To prevent a short circuit defect between terminals of an electronic component or a non-junction defect between a pad and the electronic component when mounting the electronic component to a board, in relation to a mask for solder printing used in transferring paste-like solder to a board.
The mask for solder printing includes a plurality of openings for supplying paste-like solder to a board formed with a plurality of pads. The opening includes a tubular part surrounding the whole circumference, and the tubular part is formed on a surface facing the pad independently of the other opening. The outer size of the tubular part may be smaller than the size of the pad. The inner size of the tubular part may be set larger than the size of the pad.
IDETA GORO
ABE HAJIME
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
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