PURPOSE: To prevent thermal deformation of a mask substrate, by bonding a mask support frame to a securing ring by means of an adhesive which keeps its resiliency still after cured.
CONSTITUTION: A recess 6 in a securing ring 4 is filled with adhesive 5. The reference surface of the securing ring, namely the surface on which the recess 5 is provided is contacted closely on the surface of the mask support frame 3 opposite to the one having mask patterns. A communication hole 7 provided in the securing ring 4 is aligned with a groove 9 provided on a base 9, and vacuum is drawn by means of a vacuum drawing duct 10 so that the mask support frame 3 is secured closely on the securing ring 4. A mask structure 12 thus prepared is heated to a temperature higher than a temperature used for exposure replication by several to several tens degrees so that the adhesive 5 is cured. In this manner, it is possible to prevent thermal deformation of the mask and to improve the precisions of gap and alignment between the mask and the wafer.
FUNATSU RYUICHI
KENBO YUKIO
