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Title:
大容量記憶デバイス・パッケージおよびかかるパッケージのソフトウェア定義済みアレイ
Document Type and Number:
Japanese Patent JP6931039
Kind Code:
B2
Abstract:
A mass storage devices package includes a structure comprising a stack of two or more mass storage devices of same dimensions, each having a form factor having two opposite main surfaces. The mass storage devices are superimposed in a stacking direction perpendicular to their main surfaces. The mass storage devices package further includes a controller board mounted on top of the stack, aligned therewith, the controller board including connectors connecting to the mass storage devices of the stack so as to control the mass storage devices. The controller board has a form factor having two opposite main surfaces, the latter vis-à-vis main surfaces of the more mass storage devices of the stack, wherein a maximal dimension of any of the main surfaces of the controller board is less than or equal to a maximal dimension of the structure, in any direction perpendicular to the stacking direction.

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Inventors:
Knejevic, Nikola
Naji, Zoltan
Breikertz, Solen
Application Number:
JP2019503535A
Publication Date:
September 01, 2021
Filing Date:
August 04, 2017
Export Citation:
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Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
G06F1/18; G06F3/06
Domestic Patent References:
JP2011081725A
JP2015046175A
JP2006072635A
JP2006079380A
JP2005182245A
JP2005316861A
JP2004246853A
Foreign References:
US20160132079
CN201594391U
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae