Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MAT ELECTRODEPOSITION COATING COMPOSITION
Document Type and Number:
Japanese Patent JPH10219152
Kind Code:
A
Abstract:

To obtain a coating material which can effectively hide a die mark on light metal by adding an organic solvent containing a specified amount of an organic solvent being capable of promoting the dissolution of a water-soluble resin in water and having a specified boiling point and a specified water solubility to a coating composition comprising an anionic water-soluble resin, a crosslinking resin and additives.

This material essentially consists of an anionic watersoluble resin, a crosslinking resin and additives, is freed from acetone insolubles and can be filtered with a 0.4μm filter. The solvent which can be sued in this material is one containing at least 1/3 of the entire organic solvent, organic solvent having a boiling point of 140-200°C and a water solubility of 10 or below and exemplified by propylene glycol n-butyl ether or 2-ethylhexanol. The water-soluble resin used is an acrylic resin having carboxyl or hydroxyl groups as side chains. The crosslinking resin is desirably an amino resin, and the additives used are a chelate compound, etc.


Inventors:
SASAGAWA NORIYA
OGURI HIROYUKI
SAITO HIROSHI
Application Number:
JP2135497A
Publication Date:
August 18, 1998
Filing Date:
February 04, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON PAINT CO LTD
International Classes:
B05D7/14; C09D5/00; C09D5/44; C09D7/12; C09D161/22; C09D175/04; (IPC1-7): C09D5/44; B05D7/14; C09D5/00; C09D7/12; C09D161/22; C09D175/04
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)