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Title:
MATERIAL COMPOSITION FOR PACKAGING PHOTOSENSITIVE ELEMENT AND METHOD FOR USING THE SAME
Document Type and Number:
Japanese Patent JP2004256816
Kind Code:
A
Abstract:

To provide a material composition for packaging a photosensitive element and a method for using the same.

An acid anhydride selected from hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride, methyl-bicyclo[2,2,1]-heptene-2,3-dicarboxylic anhydride, succinic anhydride, hexafluoroisopropylidene-2,2-bisphthalic anhydride, and mixtures thereof is added to a bisphenol A epoxy resin, a bisphenol F epoxy resin, an aliphatic epoxy resin, an alicyclic epoxy resin, and a mixture thereof in a ratio of 0.7-1.1 of the acid anhydride to the epoxy resin.


Inventors:
SAI-FA SHU
FUU REEN JEN
Application Number:
JP2004051294A
Publication Date:
September 16, 2004
Filing Date:
February 26, 2004
Export Citation:
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Assignee:
ETERNAL CHEMICAL CO LTD
International Classes:
C08G59/18; C08G59/42; C08G59/68; C08L63/00; (IPC1-7): C08G59/42
Domestic Patent References:
JPH07288330A1995-10-31
JP2003040972A2003-02-13
JPH07309927A1995-11-28
JP2002338659A2002-11-27
JPH0415216A1992-01-20
JPH02169620A1990-06-29
JPH0238480A1990-02-07
JP2003007738A2003-01-10
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Asano Yasutaka
Hiromi Matoba
Masaki Murata
Hiroto Yamamoto