Title:
MATERIAL FOR LOCATING GAS LEAK, METHOD FOR LOCATING GAS LEAK, MATERIAL FOR REPAIRING GAS LEAK, METHOD FOR REPAIRING GAS LEAK, AND DEVICE FOR REPAIRING GAS LEAK
Document Type and Number:
Japanese Patent JP2021156430
Kind Code:
A
Abstract:
To provide: a material for locating a gas leak and a method for locating a gas leak which enable a gas leak to be located easily by simple operation of applying the material to suspected gas leaks; and a material for repairing a gas leak, a method for repairing a gas leak and a device for repairing a gas leak which enable a gas leak to be repaired easily in a short time without the need for locating the gas leak in advance even if a large amount of gas is leaked by the gas leak.SOLUTION: Provided is a material 3 for locating gas leaks, which is to be applied to suspected gas leaks to locate a gas leak. If the viscosity of the material at 25°C and a shear rate of 0.1 s-1 is expressed by A (Pa s) and the viscosity of the material at 25°C and a shear rate of 10 s-1 is expressed by B (Pa s), then the relationship A/B≥21.0 is satisfied. The material 3 after cured has an elastic modulus of 10 MPa or more at 50°C.SELECTED DRAWING: Figure 7
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Inventors:
MORI YASUTAKA
KUBOTA TADAAKI
ABE TETSUYA
KUBOTA TADAAKI
ABE TETSUYA
Application Number:
JP2020112793A
Publication Date:
October 07, 2021
Filing Date:
June 30, 2020
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
F16L55/175
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda