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Title:
MATERIAL AND METHOD FOR PACKING LIGHT FITMENT
Document Type and Number:
Japanese Patent JP2002104518
Kind Code:
A
Abstract:

To prevent a top surface of a globe from being dented even if a pack is placed upside down without spending a material cost and time for packing, assembling and processing.

The packing material includes an outer packaging box 52 for receiving light fitment comprising a body 50 and a globe 51 attached thereto and a pad placed inside the box 52 for holding the light fitment. The pad 1 for holding the globe 51 is formed to be in contact with an upper surface and a bottom face inside the box 52 and an external slope of the globe 51. Thus, even if the pack is placed upside down or vertically, the globe 51 is supported by the pad 1, thereby preventing the globe 51 from deforming (denting). In addition, the pad 1 is in contact with the upper surface and the bottom face inside the box 52, thereby improving strength of side faces of the box 52. Accordingly, the pad 1 can be downsized, a material cost is reduced, and workability in packing and assembling is improved.


Inventors:
NAKAO HIROKI
Application Number:
JP2000293883A
Publication Date:
April 10, 2002
Filing Date:
September 27, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B65D77/26; B65D85/30; (IPC1-7): B65D77/26; B65D85/30
Attorney, Agent or Firm:
Miyai Akio



 
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