Title:
MATERIAL THICKNESS DETECTING DEVICE FOR AUTOMATIC WOOD PLANING MACHINE
Document Type and Number:
Japanese Patent JP3532745
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the operability of a material thickness detecting device for automatic wood planing machine, by making the initialization of a photoelectric sensor easier.
SOLUTION: A material thickness detecting device 13 is constituted of a gate 15, and a photoelectric sensor composed of a first light emitting device 16 and a second light receiving device 17 positioned to one end section 15a of the gate 15, and a second light emitting device 18 and a second light receiving device 19 positioned to the other end section 15a of the gate 15. The gate 15 is attached to a bridge 14 so that the lower surface of the gate 15 may be set at the highest cutting height. The light emitting and receiving devices are positioned in parallel with each other, so that the light beam L1 between the first light emitting and receiving devices 16 and 17 may be separated slightly from the lower surface of the gate 15, and the light beam L2 between the second light emitting and receiving devices 18 and 19 may be separated form the light beam L1 by the maximum cutting amount. In addition, the head sections 25 and 25 of adjusting screws 24 and 24 which are screwed in the lower surface section of the bridge 14 are inserted into the rear surface section of the gate 15, so that the height of the gate 15 may be changed when the screw 24 and 24 are turned while the gate 15 is temporarily fixed.
Inventors:
Mizumoto, Akira
Matsunaga, Takashi
Matsunaga, Takashi
Application Number:
JP27012797A
Publication Date:
May 31, 2004
Filing Date:
October 02, 1997
Export Citation:
Assignee:
MAKITA CORP
International Classes:
G01B11/06; B27C1/04; (IPC1-7): G01B11/06; B27C1/04
Attorney, Agent or Firm:
石田 喜樹