Title:
MEANDER CORRECTION DEVICE, SUBSTRATE PROCESSING DEVICE, AND MEANDER CORRECTION METHOD
Document Type and Number:
Japanese Patent JP2018043870
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of properly correcting a position of a substrate in a width direction without depending only upon an edge sensor.SOLUTION: This meander correction device includes a conveyance mechanism 10, a thickness measurement part 20, a meander prediction part 63, and a meander correction part 40. The conveyance mechanism 10 conveys a long belt-shaped substrate along a conveyance path in a longitudinal direction. The thickness measurement part 20 measures the thickness of the substrate in a plurality of measurement regions having different positions in a width direction on the conveyance path of the substrate. The meander prediction part 63 predicts later meandering of the substrate on the basis of the thickness of the substrate, and outputs meandering prediction information. The meander correction part 40 corrects the position of the substrate in a width direction on the basis of the meandering prediction information. The position of the substrate in a width direction can be corrected without depending only upon an edge sensor because meandering correction is performed on the basis of the thickness of the substrate.SELECTED DRAWING: Figure 3
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Inventors:
KAJIYA HIROYUKI
HAYASHI SHINJI
HAYASHI SHINJI
Application Number:
JP2016181223A
Publication Date:
March 22, 2018
Filing Date:
September 16, 2016
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
B65H26/02; B41J11/42; B65H23/038
Attorney, Agent or Firm:
Takami Nishida
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