Title:
基板上の液体成分の測定方法および基板処理装置
Document Type and Number:
Japanese Patent JP7082639
Kind Code:
B2
Abstract:
To provide a measuring method of a liquid component on a substrate capable of measuring on the spot, the amount of a component existing on the substrate, while processing the substrate.SOLUTION: In a measuring method of a liquid component on a substrate, process liquid S is supplied onto a rotating substrate W, and an infrared ray IR is irradiated to a liquid film F of the process liquid formed on the substrate upper surface during supply of the process liquid and/or after supply stop, and reflected light is received, and a present amount of one or more components contained in the process liquid film is measured from absorbance at a prescribed wavelength.SELECTED DRAWING: Figure 1
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Inventors:
Hiroshi Yokota
Satoshi Hiraki
Nobuyoshi Yasuda
Satoshi Hiraki
Nobuyoshi Yasuda
Application Number:
JP2020076630A
Publication Date:
June 08, 2022
Filing Date:
April 23, 2020
Export Citation:
Assignee:
Kurashiki Spinning Co., Ltd.
International Classes:
G01N21/3577; H01L21/66
Domestic Patent References:
| JP2009218402A | ||||
| JP60224002A | ||||
| JP2008096309A | ||||
| JP2003130615A | ||||
| JP2013033817A | ||||
| JP2012216754A | ||||
| JP2014045150A | ||||
| JP2013057513A | ||||
| JP2008311256A | ||||
| JP7181018A | ||||
| JP2006023200A |
Foreign References:
| US20140268160 |
Attorney, Agent or Firm:
Kawahara Tetsuro
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