Title:
MEASUREMENT OF SURFACE SHAPE OF CUT WAFER
Document Type and Number:
Japanese Patent JPH07106387
Kind Code:
A
Abstract:
PURPOSE: To prevent a dull blade from causing reduction in the throughput, such as interruption of a cutting work.
CONSTITUTION: A surface displacement measuring means 3 is provided in the middle of a transfer path that transfers a cut wafer 100 from directly under an ingot 200 to a wafer housing part 15 and the surface shape of the wafer is measured during the transfer. Thereby, a dull blade, which results in defective wafers, can be detected from the measured surface shape of the wafer.
Inventors:
YOSHIDA YUICHI
MIYAZAKI YOSHIMASA
TSUBOI MASAAKI
MIYAZAKI YOSHIMASA
TSUBOI MASAAKI
Application Number:
JP25185593A
Publication Date:
April 21, 1995
Filing Date:
October 07, 1993
Export Citation:
Assignee:
NIPPON STEEL CORP
NITTETSU DENSHI KK
NITTETSU DENSHI KK
International Classes:
H01L21/66; B23D59/00; H01L21/304; (IPC1-7): H01L21/66; H01L21/304
Attorney, Agent or Firm:
Mikio Hatta