To provide a measuring device which can measure the height of a measurement section in a mounting component rapidly with a high degree of accuracy.
A distance sensor 12 is moved in the direction which is parallel to a substrate surface 31 and along predetermined scanning lines (L1-L3) by an orthogonal robot. A measurement signal is outputted to the distance sensor 12 by a control circuit, whenever the distance sensor 12 moves for a predetermined distance, on the basis of the movement amount of the distance sensor 12 which is measured by an encoder. When a formation waveform is generated in which the height from the substrate surface 31 which is obtained from relative distance measured by the distance sensor 12 is determined as a vertical axis and a scanning position is determined as a horizontal axis, the measurement height of a press face 45a of each of connector pins 42a-42c is calculated from the height from the substrate surface 31 corresponding to the scanning position of the press face 45a, on the basis of the formation waveform.
NISHIJIMA HIROSHI
JPH07273500A | 1995-10-20 | |||
JPH10261900A | 1998-09-29 | |||
JP2001144497A | 2001-05-25 | |||
JP2005243777A | 2005-09-08 | |||
JP2005251777A | 2005-09-15 | |||
JP2004273578A | 2004-09-30 | |||
JP2006135158A | 2006-05-25 | |||
JP2009074931A | 2009-04-09 |
Katsuhiko Tateishi
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