To increase the possibility of high resolution imaging at a deep brain part.
The measurement device comprises a thin substrate and an image sensor chip fixed on the thin substrate. In this case, the image sensor chip comprises a pixel array for which a plurality of pixel cells for performing photoelectric conversion are two-dimensionally disposed, a connection pad for connecting metal wiring on the thin substrate with a wire, a peripheral circuit connected between the pixel array and the connection pad for image measurement by the pixel array, and at least one through-hole provided in a region where the pixel array is formed and made to pass through from a first surface provided with the pixel cells of the image sensor chip to a second surface on the opposite side.
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Sadao Shiozaka
Atsushi Ota
Tamura Hideki
Naoki Matsubara
Sugimoto Masuki
Semiconductor Science and Engineering Research Center Co., Ltd.
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