Title:
MEASURING METHOD OF PLACE OF WAFER AND WAFER ALIGNMENT AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP2626582
Kind Code:
B2
Abstract:
PURPOSE: To obtain the central place of a water from the quantities of light received of photosensors by equally arranging the six sets of light-projecting devices, from which band-shaped light is emitted, and the photosensors at six radial positions in the longitudinal direction on a circumference having the same diameter as the wafer in band-shaped light.
CONSTITUTION: Light-projecting devices 1, by which laser beams from a laser source are changed into band-shaped light in width of approximately 10mm by lenses, and photosensors 2 receiving the band-shaped light through lenses are used as one sets in a measuring unit 7, and the measuring unit 7 is composed of a stand 3, on which each set is fixed so that the centers of cut ends 9 by surfaces vertical to the optical axes of band-shaped light are disposed equally at six places on a circumference having the same diameter as a water 6 and the cross directions of the band-shaped light are directed radially, and a control section, into which the quantities of light received of the photosensors 2 are input and in which movement given to the wafer 6 is acquired and by which the movement is indicated to a robot 4 holding and carrying the wafer 6. Accordingly, the central position of the wafer is obtained from the quantities of light received of a plurality of the photosensors of sections not shielded by the wafer in band-shaped light, thus shortening the alignment time.
Inventors:
Masato Ashida
Application Number:
JP26374194A
Publication Date:
July 02, 1997
Filing Date:
October 27, 1994
Export Citation:
Assignee:
NEC
International Classes:
G01B11/00; B25J9/06; B25J13/08; B25J15/08; B65G49/07; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B25J9/06; B25J13/08; B25J15/08; B65G49/07; G01B11/00
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)