Title:
機械的応力低減型のマイクロキャビティ・プラズマ装置アレイおよび電極
Document Type and Number:
Japanese Patent JP5318857
Kind Code:
B2
Abstract:
In a preferred method of formation embodiment, a thin metal foil or film is obtained or formed with microcavities (such as through holes). The foil or film is anodized symmetrically so as to form a metal-oxide film on the surface of the foil and on the walls of the microcavities. One or more self-patterned metal electrodes are automatically formed and simultaneously buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity, and electrodes for adjacent microcavities can be isolated or connected. If the microcavity is cylindrical, the electrodes form as rings around each cavity.
Inventors:
Eden, Jay Gary
Park, San Jin
Park, San Jin
Application Number:
JP2010508425A
Publication Date:
October 16, 2013
Filing Date:
May 15, 2008
Export Citation:
Assignee:
The Board of Trustees of the University of Illinois
International Classes:
H01J11/18; H01J9/02; H01J17/04; H01J17/16; H01J17/49; H01J65/00
Domestic Patent References:
| JP2008098150A | ||||
| JP2009502010A | ||||
| JP49029571A | ||||
| JP2006156352A | ||||
| JP2008235274A |
Foreign References:
| WO2007011865A1 | ||||
| WO2008013820A1 |
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Yasuyuki Hata
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Yasuyuki Hata