Title:
医療用インプラント
Document Type and Number:
Japanese Patent JP5897795
Kind Code:
B2
Abstract:
The medical implant comprises a biocompatible, electrically conductive polymer with electrical resistivity, which has the property of getting heated and softened by a flow of current through the polymer. The polymer is a thermoplastic material, which is polyacetylene, polyaniline, polyethylenedioxythiophene, polyphenylene vinylene, polyarylene, polyspirobifluorene, polydialkylfluorene, polythiophene, polypyrrole, polyetheretherketone, polymethylmetacrylate or polylactide. The medical implant materials comprises collagen. An independent claim is also included for a method for osteosynthesis.
Inventors:
Bere, Wolf Friedrich
Luffyux, Kurt
Luffyux, Kurt
Application Number:
JP2010513597A
Publication Date:
March 30, 2016
Filing Date:
July 03, 2007
Export Citation:
Assignee:
Synergy biosurgical acti genzel shaft
International Classes:
A61L27/00; A61B17/56; A61C8/00; A61F2/32; A61L17/00
Domestic Patent References:
| JP2167159A | ||||
| JP2007511329A | ||||
| JP9511666A | ||||
| JP8506027A | ||||
| JP2006500762A |
Foreign References:
| WO2001047337A2 | ||||
| WO2006069677A2 |
Attorney, Agent or Firm:
Haruo Hamada