Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MELAMINE RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS62212453
Kind Code:
A
Abstract:

PURPOSE: To provide the titled molding material which has excellent heat crack resistance and hardly cause discoloration by heat and warpage, consisting of a guanamine-modified melamine resin, an inorg. fibrous substrate and an inorg. non-fibrous substrate.

CONSTITUTION: 1mol of melamine, 3W4mol of formaldehyde and benzoguanamine or acetoquanamine in an amount of 1.2W1.8 times by mol that of melamine are subjected to an addition condensation reaction by heating at a pH of 8W9 to obtain a guanamine-modified melamine resin (A). 35W55pts.wt. component A is blended with 5W15pts.wt. inorg. fibrous material (B) (e.g., glass fiber), 30W60pts.wt. inorg. non-fibrous material (C) (e.g., CaCO3) and optionally, a plasticizer, a parting agent, a colorant, etc. (D).


Inventors:
ICHIKAWA MASAYA
YOKOYAMA MASAYUKI
Application Number:
JP5761286A
Publication Date:
September 18, 1987
Filing Date:
March 14, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/28; C08K3/00; C08K7/04; C08K13/04; C08L61/20; (IPC1-7): C08K3/00; C08K7/04; C08K13/04; C08L61/28
Attorney, Agent or Firm:
Ishida Choshichi



 
Previous Patent: POLYACETAL RESIN COMPOSITION

Next Patent: COMPOSITION