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Title:
MEMBER FOR SUPPORTING CERAMIC SUBSTRATE FOR MANUFACTURING AND INSPECTING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2002141399
Kind Code:
A
Abstract:

To provide a supporting member for supporting a ceramic heater excellent in temperature uniformity of heating surface or a ceramic substrate provided by function of an electrostatic chuck safely and effectively supporting a wafer and a wafer prober, especially structure of the supporting member having an intermediate bottom plate and a bottom plate having high flatness.

The supporting member for supporting the ceramic substrate for manufacturing and inspecting semiconductor comprises the substrate, the intermediate bottom plate 11, and/or the bottom plate arranged in isolation in a cylindrical casing from top to bottom in this order, wherein a number of recesses 20 are set up on at least either the intermediate bottom plate 11 or the bottom plate, and the flatness of these plates are suppressed within 0.2 mm or less.


Inventors:
FURUKAWA MASAKAZU
KARIYA SATORU
SAITO YUZURU
Application Number:
JP2000338830A
Publication Date:
May 17, 2002
Filing Date:
November 07, 2000
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
H05B3/16; H01L21/027; H01L21/302; H01L21/3065; H01L21/68; H01L21/683; H05B3/18; H05B3/68; (IPC1-7): H01L21/68; H01L21/027; H01L21/3065; H05B3/16; H05B3/18; H05B3/68
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)