Title:
半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
Document Type and Number:
Japanese Patent JP4876626
Kind Code:
B2
Inventors:
Nanako Kato
Hiroshi Mori
Hiroshi Kobayashi
Sotomura Tsubasa
Hiroshi Mori
Hiroshi Kobayashi
Sotomura Tsubasa
Application Number:
JP2006047274A
Publication Date:
February 15, 2012
Filing Date:
February 23, 2006
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
H01L33/52; C08G77/16; C08G79/00; C08K3/20; C08L83/06; H01L33/50; H01L33/54; H01L33/56; H01L33/60; H01L33/62
Domestic Patent References:
| JP4119940B2 | ||||
| JP2005056953A |
Attorney, Agent or Firm:
Yu Sanada