Title:
膜形成基材
Document Type and Number:
Japanese Patent JP6986292
Kind Code:
B2
Abstract:
An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a microetching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.
Inventors:
Kenji Nishie
Yuki Oka
Tomoko Ichihashi
Takuto Fujii
Yuki Oka
Tomoko Ichihashi
Takuto Fujii
Application Number:
JP2020060064A
Publication Date:
December 22, 2021
Filing Date:
March 30, 2020
Export Citation:
Assignee:
MEC COMPANY
International Classes:
B32B15/08; C23C26/00
Domestic Patent References:
| JP2016132810A | ||||
| JP7070767A | ||||
| JP2009532205A | ||||
| JP2005191330A | ||||
| JP2000255015A |
Attorney, Agent or Firm:
Izawa Makiko