メモリーカードの実装構造体

Title:

メモリーカードの実装構造体

Document Type and Number:

Japanese Patent JP7380684

Kind Code:

B2

Abstract:

Provided is a memory card mounting structure offering heat-radiating effects.　Provided is a memory card mounting structure (1) comprising at least a semiconductor element housing package (12), a first thermally conductive layer (13), a second thermally conductive layer (15), a first radiant sheet (14), and a second radiant sheet (16), wherein the semiconductor element housing package (12), first thermally conductive layer (13), first radiant sheet (14), second thermally conductive layer (15), and second radiant sheet (16) are stacked in that order. The first radiant sheet (14) and/or the second radiant sheet (16) may be a metal sheet.

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Inventors:

Akira Kadonaga

Application Number:

JP2021520082A

Publication Date:

November 15, 2023

Filing Date:

March 26, 2020

Export Citation:

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Assignee:

Sony Group Corporation

International Classes:

G06K19/077; H01L23/12; H05K7/20

Domestic Patent References:

JP11067993A
JP11145379A
JP2017139589A
JP2018107549A
JP2013075421A

Attorney, Agent or Firm:

Kaoru Watanabe

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