To make a contact state between a contact and a contact pad suitable to show performance of various memory cards when mounting the memory card.
When mounting a high-speed memory card MC2, a contact section 16 of a contact piece 13 is not come in contact with a rib 106 by a relief section 111 arranged on the rib 106 of a high-speed memory card MC2 regarding contacts C10-C13. At this time, a touch section 10 of a touch piece 12 comes in contact with contact pads P10-P13 formed on the bottom surface of a recessed section 110 for a contact pad. On the other point, when mounting a conventional memory card, a lower surface of the contact section 16 of the contact piece 13 comes in contact with an upper surface of the rib 106, the touch piece 12 connected with the contact piece 13 at its base end section is pushed upward because the contact section 16 is pushed up, and the touch section 10 of the touch piece 12 is separated from the contact pad.
KIMURA NOBUHIKO
TAKEYAMA HIDETOSHI
Atsuo Mori