Title:
MEMS HAVING 3-WAFER STRUCTURE
Document Type and Number:
Japanese Patent JP2005052963
Kind Code:
A
Abstract:
To reduce a stray capacity between two chips in an MEMS element, thereby reducing a cost.
A micro-electro-mechanical system comprises a first wafer 30, a second wafer 40 including a movable part 50, and a third wafer 20. The movable part 50 can be moved between the first wafer 30 and the third wafer 20. The first wafer 30, the second wafer 40, and the third wafer 20 are bonded together.
Inventors:
HARTWELL PETER G
HOEN STORRS T
HORSLEY DAVID
YANG CHUNG CHING
MERCHANT PAUL P
TAUSSIG CARL P
HOEN STORRS T
HORSLEY DAVID
YANG CHUNG CHING
MERCHANT PAUL P
TAUSSIG CARL P
Application Number:
JP2004223868A
Publication Date:
March 03, 2005
Filing Date:
July 30, 2004
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO
International Classes:
G01P15/125; B81B3/00; B81B5/00; B81B7/00; B81B7/02; H01L29/82; H01L33/00; (IPC1-7): B81B3/00
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Kiyoharu Nishiyama
Takahiko Mizobe
Kiyoharu Nishiyama
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