To provide a MEMS microphone module which can sufficiently absorb a stress and have excellent sensitivity even when a nozzle having a small internal diameter is used or adhesive bond having low viscosity is used to prevent the nozzle from being clogged.

A MEMS microphone module 100 comprises: a substrate 110; a MEMS microphone element 120; and an adhesive 130 which bonds the substrate 110 to the MEMS microphone element 120. The MEMS microphone element 120 comprises: a first principal surface; a second principal surface which is opposite to the first principal surface; a pedestal 121 through which an open hole 124 penetrating from the first principal surface to the second principal surface is formed; and a diaphragm 122 which is formed on the first principal surface of the pedestal 121 and covers a part of the open hole 124. The adhesive 130 bonds the second principal surface of the pedestal 121 to the substrate 110, and covers a part of a side face of the pedestal 121, and at least one recess part 125 is formed at a surface boundary with the adhesive 130 on the second principal surface of the pedestal 121.