Title:
金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法
Document Type and Number:
Japanese Patent JP7007138
Kind Code:
B2
Abstract:
To provide a metal atom-containing grain in which the component of the projections in the metal part of the metal atom-containing grains can be metal-diffused or metal-deformed at a relatively low temperature, and can be joined to the other grains or the other member, and joining reliability can be increased.SOLUTION: Provided is a grain comprising a base material grain and a metal part arranged on the surface of the base material grain, the metal part has a plurality of projections at the outer surface, the projections of the metal part include a component(s) capable of metal diffusion at 400°C or lower or the projections of the metal part can be metal-deformed at 400°C or lower, and the melting point of the part free from the projections of the metal part exceeds 400°C.SELECTED DRAWING: Figure 1
Inventors:
Masao Sasahira
Application Number:
JP2017173781A
Publication Date:
February 10, 2022
Filing Date:
September 11, 2017
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; B23K35/14; H01B1/00; H01B1/22; H01R11/01; H01R43/00
Domestic Patent References:
| JP61077278A | ||||
| JP2011204969A | ||||
| JP2007250464A |
Foreign References:
| WO2007058159A1 |
Attorney, Agent or Firm:
特許業務法人 宮▲崎▼・目次特許事務所