Title:
金属ベース基板
Document Type and Number:
Japanese Patent JP7036131
Kind Code:
B2
Abstract:
A metal base substrate includes a metal substrate (10), an insulating layer (20), and a metal foil (40) which are laminated in this order, wherein the metal base substrate further includes an adhesive layer (30) between the insulating layer (20) and the metal foil (40), and the adhesive layer (30) satisfies Expressions (1) to (3), in which E represents a Young's modulus at 25°C having a unit of GPa, T represents a thickness having a unit of µm, and λ represents a thermal conductivity in a thickness direction having a unit of W/mK, E≤15≤T/ET/λ<20.
Inventors:
Ishikawa Shiro
Application Number:
JP2019569071A
Publication Date:
March 15, 2022
Filing Date:
January 24, 2019
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H05K1/05; H01L23/36; H05K3/38
Domestic Patent References:
| JP2015043417A | ||||
| JP2004335928A | ||||
| JP2006270065A | ||||
| JP11087866A |
Foreign References:
| WO2010092905A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami