To provide a metal bonding method capable of obtaining the sufficient initial bonding strength, and preventing any degradation of the bonding strength and any dispersion in the bonding strength while keeping a metal bonded body at a high temperature for a long time or during the heat cycle test.
The metal bonding method includes: a contact step of bringing a bonding surface of an Al member mainly consisting of aluminum, and a bonding surface of a Cu member mainly consisting of copper into contact with each other; a pressing step of applying the pressure to the bonding surface of the Al member and the bonding surface of the Cu member in the direction perpendicular to the surfaces; and a step of heating the bonding surface of the Al member and the bonding surface of the Cu member with the pressure being applied thereto in the vertical direction at the temperature equal to or higher than the eutectic temperature between aluminum and copper, and at the temperature ≤620°C.
COPYRIGHT: (C)2010,JPO&INPIT
MAEDA CHISAKO
ARAKI TAKESHI
YAMADA AKIRA
| JPS52152848A | 1977-12-19 |
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
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