DEPOSITION APPARATUS OF METALLIC FILM AND DEPOSITION METHOD THEREOF

Japanese Patent JP2023059748

A

To provide a deposition apparatus 1 of a metallic film F that suppresses the occurrence of irregularities on the surface of the metallic film F and improves the quality of deposition.SOLUTION: A deposition apparatus 1 comprises: an anode 11; a solid electrolyte membrane 13 arranged between the anode 11 and a substrate B; a power supply unit 14 for applying a voltage between the anode 11 and the substrate B as a cathode; and a liquid container 15 for holding the anode 11 and the solid electrolyte membrane 13 apart from each other, and for accommodating an electrolyte L including metallic ions between the anode 11 and the solid electrolyte membrane 13. The solid electrolyte membrane 13 includes a central part 13a contacting the substrate B and the electrolyte L, and an outer rim part 13b positioned outside the central part 13a. The deposition apparatus 1 also comprises a membrane stretching mechanism 18 for stretching the central part 13a of the solid electrolyte membrane 13 by applying a tensile force to the central part 13a in the direction from the central part 13a to the outer rim part 13b in a state that a heated electrolyte L is accommodated in the liquid container 15.SELECTED DRAWING: Figure 1

KONDO HARUKI
INAGAKI KOJI
KURODA KEIJI
OKAMOTO KAZUAKI

JP2021169934A

April 27, 2023

October 15, 2021

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TOYOTA MOTOR CORP

C25D17/00; C25D21/12

Patent Attorney Corporation Hiraki International Patent Office

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