Title:
METAL FILM AND SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2020090706
Kind Code:
A
Abstract:
To provide a metal film capable of suppressing an etching rate, even when using etchant containing nitric acid, and performing accurately an etching treatment; and to provide a sputtering target used for depositing the metal film.SOLUTION: A metal film contains a Pd content of 40 mass ppm or less, a Pt content of 20 mass ppm or less, an Au content of 20 mass ppm or less, a Rh content of 10 mass ppm or less, and a total content of Pd, Pt, Au and Rh of 50 mass ppm or less, and has a residue comprising Ag and inevitable impurities.SELECTED DRAWING: None
Inventors:
TOSHIMORI YUTO
NONAKA SOHEI
KOMIYAMA SHOZO
HAYASHI YUJIRO
NONAKA SOHEI
KOMIYAMA SHOZO
HAYASHI YUJIRO
Application Number:
JP2018228365A
Publication Date:
June 11, 2020
Filing Date:
December 05, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C23C14/14; C22C5/06; C23C14/34; G02F1/1335; G02F1/1343
Domestic Patent References:
| JPH06279992A | 1994-10-04 | |||
| JP2017031503A | 2017-02-09 |
Foreign References:
| WO2014097943A1 | 2014-06-26 | |||
| CN103243305A | 2013-08-14 | |||
| WO2016136590A1 | 2016-09-01 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami