To provide a metal foil which enables an electric resistance material to be built-in in a board by further forming an electric resistance film on a copper foil, and has little variation in a resistance value by increasing the adhesion of the electric resistance film, and to provide a board for a printed circuit.

The metal foil includes a copper-zinc alloy film formed on a metal foil surface adjusted to 4.0-6.0 μm in ten-point average roughness Rz measured with an optical means, an stabilizing film consisting of at least one component selected from among zinc oxide, chromium oxide and nickel oxide formed on the copper-zinc alloy film, and the electric resistance film consisting of a nickel-chromium alloy formed on the stabilizing film, and further includes tetraethoxysilane adsorbed and dried on the electric resistance film. The variation in the resistance value of the electric resistance film is limited within ±10%.