Title:
METAL LAMINATE AND METHOD OF MANUFACTURING CORE SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2011119641
Kind Code:
A
Abstract:
To provide a metal laminate that can be doubled in productivity thereof by symmetrically forming two core substrates above and below an insulating base material, can prevent the generation of waste since the insulating base material and carrier layers can be utilized as a bare substrate during manufacturing of a printed circuit board, and can be recycled, and to provide a method of manufacturing a core substrate using the same.
The metal laminate according to the present invention includes: the insulating base material; the carrier layers of a metal material laminated on both surfaces of the insulating base material; and first metal thin films laminated on one surface of each of the carrier layers.
Inventors:
LEE SANG-YOUP
RYU JOUNG-GUL
KIM DONG-SUN
CHOI JAE-HOON
SEO IN-HO
LEE JOON-SUNG
RYU JOUNG-GUL
KIM DONG-SUN
CHOI JAE-HOON
SEO IN-HO
LEE JOON-SUNG
Application Number:
JP2010120258A
Publication Date:
June 16, 2011
Filing Date:
May 26, 2010
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H05K3/00; H05K3/46
Domestic Patent References:
| JP2005101137A | 2005-04-14 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Masakazu Ito