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Title:
金属表面粗化層を有する金属層積層体及びその製造方法
Document Type and Number:
Japanese Patent JP5178064
Kind Code:
B2
Abstract:
Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.50 as calculated using a box counting method with the measurement object region being set to from 50 nm to 5 μm and the box size (pixel size) being set to 1/100 or less of the measurement object region. The metal layer laminate is obtained by a production method including the steps of forming a resin thin film on the surface of a metal layer and subjecting the resin thin film-carrying metal layer to a plating process.

Inventors:
Seki Ueki
Application Number:
JP2007169204A
Publication Date:
April 10, 2013
Filing Date:
June 27, 2007
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
B32B15/08; C23C28/00; H05K3/18; H05K3/38
Domestic Patent References:
JP7038215A
JP2000141542A
JP2005193398A
JP2007015545A1
JP2004358961A
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda



 
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