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Japanese Patent JP7175354

B2

To provide a metal mask capable of accurately forming an object at a predetermined position on a workpiece.SOLUTION: In a metal mask provided with a through hole 12 corresponding to a predetermined pattern, the through hole 12 includes an introduction hole portion 15 that opens in a surface of a mask body 10, and a holding hole portion 16 provided on the lower side of the introduction hole portion 15, and height dimensions of the holding hole portion 16 on one side edge and the other side edge thereof are set to heights different from each other and in a cross-sectional view in a thickness direction of the mask body 10, an inner surface of one side edge of the introduction hole portion 15 faces the inner surface of the other side edge of the holding hole portion 16.SELECTED DRAWING: Figure 6

JP2001506058	PROBLEM TO BE SOLVED: To provide a TAB tape ball grid array package provided with a through hole laterally displaced from a bonding region of a solder ball.
JP5618873	Manufacturing method of semiconductor devices
JPH0691143	[Title of Invention] TAB Tape

Kiichiro Ishikawa
Yoshihiro Kobayashi

JP2021123929A

November 18, 2022

July 29, 2021

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Maxell Co., Ltd.

H01L21/60

JP2006147697A
JP9262722A
JP2002164369A

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