Title:
METAL MOLD FOR RESIN SEALING OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5923528
Kind Code:
A
Abstract:
PURPOSE:To eliminate wasting of resin, by a method wherein top force to constitute a resin sealing metal mold is provided with a plunger inserting port of narrow rectangular shape, a bottom force is provided with a plurality of narrow groove-shaped ports connected with each other to receive resin forced through the inserting port, and a product resin receiving member is formed on each pot. CONSTITUTION:A bottom force to constitute a resin sealing mold is provided with three pots 10 of narrow groove shape in parallel to receive resin, and a transverce connecting groove 11 connects between the pots 10. On both sides of each pot 10 are provided product resin sealing members 9 so as to flow the resin directly through the pot 10. On a top force 1 to be combined to the bottom force 2 is bored a plunger inserting port 12 corresponding to the pot 10 at the center of the bottom force 2 and opened in nearly the same shape as that in the bottom force 2. In this constitution, resin forced through the plunger inserting port 12 is flowed from the pot 10 to the sealing member 9 directly and the resin to be wasted is reduced significantly.
Inventors:
KUWABARA KOUJI
Application Number:
JP13318682A
Publication Date:
February 07, 1984
Filing Date:
July 30, 1982
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
B29C45/00; B29B7/00; B29C35/00; B29C39/00; B29C39/10; B29C39/26; B29C41/00; B29C45/02; B29C45/14; B29C45/27; B29C45/37; H01L21/56; (IPC1-7): B29C6/00; B29F1/022; B29F1/10
Attorney, Agent or Firm:
Sugano Naka