Title:
金属粒子凝集体とその製造方法、ペースト状金属粒子組成物および接合体の製造方法
Document Type and Number:
Japanese Patent JP6870436
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic particle capable of forming a joining layer that can join members, such as an electronic component, with high bonding strength and long term reliability.SOLUTION: This invention relates to a metallic particle aggregate, comprising metallic particles and an organic substance. The metallic particles have 70 mass% or more of at least one metal selected from the group comprising silver, gold, and copper and contain 60 vol.% or more and 95 vol.% or less of particles each having a particle diameter in a range of 100 nm or more and less than 500 nm, 5 vol.% or more and 40 vol.% or less of particles each having a particle diameter in a range of 50 nm or more and less than 100 nm, and 5 vol.% or less of particles each having a particle diameter of less than 50 nm. In a particle size distribution curve by volume, measured by a laser diffraction scattering method: D10 is in a range of 0.05 μm or more and 0.25 μm or less; D50 is in a range of 0.4 μm or more and 0.6 μm or less; and D90 is in a range of 1.5 μm or more and 2.5 μm or less. The organic substance that the metallic particles contain accounts for 2 mass% or less of the metallic particles.SELECTED DRAWING: None
Inventors:
Mountain Saki Kazuhiko
Kotaro Masuyama
Kotaro Masuyama
Application Number:
JP2017072991A
Publication Date:
May 12, 2021
Filing Date:
March 31, 2017
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B22F1/00; B22F1/02; B22F7/04; B22F7/08; B22F9/00; B82Y30/00; B82Y40/00
Domestic Patent References:
| JP2017052668A | ||||
| JP2016148089A |
Foreign References:
| WO2016125355A1 | ||||
| WO2017033911A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga