Title:
METAL PARTICLE, PASTE FOR FORMING CONDUCTIVE FILM, AND ARTICLE
Document Type and Number:
Japanese Patent JP2015115147
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a paste for forming a conductive film that has low viscosity and can form a conductive film having a small surface roughness of the conductive film, to provide a metal particle used in the paste for forming a conductive film, and to provide an article having a conductive film formed from the paste for forming a conductive film.SOLUTION: The metal particle is used in a paste for forming a conductive film and has an aspect ratio of 2.5-6 and a chlorine content of 40-110 mass ppm. Carbon derived from an organic acid is present in the surface of the particle and the mass ratio (C/M) of the abundance of the carbon to the abundance of metal in the surface of the particle is 1.40 to 3.00.
Inventors:
SHIMIZU AKIHIKO
Application Number:
JP2013255426A
Publication Date:
June 22, 2015
Filing Date:
December 10, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
H01B5/00; B32B7/02; H01B1/00; H01B1/22; H01B5/14
Domestic Patent References:
| JP2012136771A | 2012-07-19 | |||
| JP2011017067A | 2011-01-27 | |||
| JP2008108629A | 2008-05-08 |
Foreign References:
| WO2012046666A1 | 2012-04-12 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masatake Shiga