Title:
METAL PARTICLES, MANUFACTURING METHOD THEREOF, RESIN COMPOSITION, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003089807
Kind Code:
A
Abstract:
To provide a metal particle manufacturing method in which metal particles having a desired shape, grain size and grain size distribution can be easily manufactured with excellent productivity, and to provide a resin composition and an adhesive film with excellent heat radiation and electric conductivity which are used to affix a semiconductor element having excellent heat conductivity containing the metal particles to a semiconductor supporting member.
Part of a metal foil is removed to obtain metal particles of an arbitrary shape consisting of remaining metal foil pieces. The metal particles are incorporated in the resin to form the film-like adhesive film.
Inventors:
INADA TEIICHI
HAYASHI HIROKI
NAKAMURA HIDEHIRO
HAYASHI HIROKI
NAKAMURA HIDEHIRO
Application Number:
JP2001279497A
Publication Date:
March 28, 2003
Filing Date:
September 14, 2001
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K3/08; B22F9/04; C08L101/00; C09J7/00; C09J9/02; C09J11/04; C23F1/00; H01L21/52; (IPC1-7): B22F9/04; C08K3/08; C08L101/00; C09J7/00; C23F1/00; H01L21/52
Attorney, Agent or Firm:
Hotaka Tetsuo
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