Title:
金属研磨用組成物、及び化学的機械的研磨方法
Document Type and Number:
Japanese Patent JP5202258
Kind Code:
B2
Abstract:
The invention provides a metal polishing composition that is used in chemical mechanical polishing in production of a semiconductor device, and includes an oxidizing agent, an abrasive grain, and at least one compound selected from compounds represented by the following formula (I) and the following formula (II). The invention also provides a chemical mechanical polishing method that uses the metal polishing composition. In formula (I), R1 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring. In formula (II), R2 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring.
Inventors:
Takamiya Toshimi
Tadashi Inaba
Atsushi Mizutani
Tomo Kato
Toshiyuki Saie
Tadashi Inaba
Atsushi Mizutani
Tomo Kato
Toshiyuki Saie
Application Number:
JP2008307211A
Publication Date:
June 05, 2013
Filing Date:
December 02, 2008
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2004172606A | ||||
| JP2004207468A | ||||
| JP2005019519A | ||||
| JP2005223257A | ||||
| JP2006261333A | ||||
| JP2007251057A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda