METAL POLISHING SOLUTION MATERIAL AND METAL POLISHING SOLUTION

Title:

METAL POLISHING SOLUTION MATERIAL AND METAL POLISHING SOLUTION

Document Type and Number:

Japanese Patent JP2011009783

Kind Code:

A

Abstract:

To provide a metal polishing solution material in which a protective-film forming agent having low water solubility is dissolved at a high concentration without deposition, the metal polishing solution material allowing a metal polishing solution to be easily prepared by a diluent being added thereto when polishing is actually performed.

The metal polishing solution containing an oxidizing agent, an oxidized-metal dissolving agent, a protective-film forming agent, a dissolution promoter for the protective-film forming agent, and water; and a metal polishing solution material for preparing the metal polishing solution, the metal polishing solution material including an oxidized-metal dissolving agent, a protective-film forming agent, and a dissolution promoter for the protective-film forming agent.

Inventors:

UCHIDA TAKESHI
HOSHINO TETSUYA
TERASAKI HIROKI
KAMIGATA YASUO
KOYAMA NAOYUKI
HONMA YOSHIO
KONDO SEIICHI

Application Number:

JP2010226711A

Publication Date:

January 13, 2011

Filing Date:

October 06, 2010

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD
HITACHI LTD

International Classes:

H01L21/304; B24B37/00; C09G1/02; C09K13/00; C23F3/00; H01L21/321

Attorney, Agent or Firm:

Hidekazu Miyoshi

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