PURPOSE: To obtain a metal powder composition for metallizing having high adhesion strength to a ceramic substrate with which a metal oxide film having small volume resistance can be obtd., and to produce a metallized substrate by specifying the chemical compsn. of the metal powder.

CONSTITUTION: The metal powder compsn. for metallizing essentially consists of Cu and Ti and contains at least one of Ag, Al, Zr as a subcomponent. The compsn. contains the main component metal powder by 90-99.5wt.% and the subcomponent metal powder by 0.5-10wt.%. The optimum compsn. ratio of the main component is 85-99wt.% Cu and 1-15wt.% Ti. Apaste for metallizing comprising this metal powder compsn. for metallizing, dispersant and binder is prepared and applied on a ceramic substrate once or several times to obtain 80μm or more thickness by screen printing. Then the paste is baked in vacuum or inert gas atmosphere. Thus, a metallized substrate having high adhesion strength to a ceramic substrate can be obtd.