METAL POWDER FOR SOLDER PASTE AND MANUFACTURE

Title:

METAL POWDER FOR SOLDER PASTE AND MANUFACTURE

Document Type and Number:

Japanese Patent JPH11245079

Kind Code:

A

Abstract:

To enable reflow soldering in the atmosphere and improve paste storage life by coating a surface of solder powder with a coating film which is in a solid condition at a normal temperature and is vanished at solder melting temperature when it is heated by a reflow soldering process.

A globular solder powder 2 constituting a metal powder 1 for the solder paste is composed of a Sn-Zn system material, and its surface is coated with a coating film 3, namely N-methylacetamido CH3CONHCH3 (the melting point 31°C, the boiling point 206°C) at the thichkness of about 0.1 μm. The solder paste metal powder 1 is mixed with a proper solvent so as to manufacture a solder paste. Ethylene carbonate (CH2O)2CO, 2-acetylpyrrole C6H7NO, acetamido CH3OONH2 and the like are used as the coating film 3. Sn-Ag system or Sn-Bi system materials(Sn-9Zn eutectic crystal, Sn-35Ag eutectic crystal, and Sn-58Bi eutectic crystal) can be used as the solder powder 2.

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Inventors:

ITO HISASHI
WATANABE NAOTAKE
MORI IKUO

Application Number:

JP4750998A

Publication Date:

September 14, 1999

Filing Date:

February 27, 1998

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

B23K35/22; B22F1/02; B23K35/26; B23K35/363; C23C14/00; H05K3/34; (IPC1-7): B23K35/22; B22F1/02; B23K35/26; B23K35/363; C23C14/00; H05K3/34

Attorney, Agent or Firm:

Norio Ogo (1 outside)

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