金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法

Title:

金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法

Document Type and Number:

Japanese Patent JP7216094

Kind Code:

B2

Abstract:

The present disclosure provides a metal-silicon carbide-based composite material including: a composite part including a silicon carbide-based porous body constituted by a plurality of silicon carbide particles, and a metal that is infiltrated in the silicon carbide-based porous body; and first and second surface layers which contain a metal, and coat both main surfaces of the composite part. The metal contains at least one kind selected from the group consisting of aluminum and magnesium, and the amount of particles having a particle size of 300 µm or more in the plurality of silicon carbide particles is 5% by volume or less.

More Like This:

JP6310799	Method for manufacturing thermosetting resin composition, semiconductor device, electrical / electronic parts and plate-type silver fine particles
WO/2020/081688	GAP FILLERS WITH INDEPENDENTLY TUNABLE MECHANICAL AND THERMAL PROPERTIES
JP2003007932	PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

Inventors:

Daisuke Goto
Hiroro Ota

Application Number:

JP2020530272A

Publication Date:

January 31, 2023

Filing Date:

July 11, 2019

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Denka Co., Ltd.

International Classes:

H01L23/373; B32B15/00; B32B18/00

Foreign References:

WO2007125878A1

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Takeshi Nakatsuka

Previous Patent: Casting equipment and casting method

Next Patent: Power steering system operation control method