Title:
METAL SURFACE COATING FILM FORMATION COMPOSITION INCLUDING HYDROXY GROUP CONTAINING POLYMER
Document Type and Number:
Japanese Patent JP2022108852
Kind Code:
A
Abstract:
To provide: a metal surface coating film formation composition useful, especially, in the re-wiring formation step of a semiconductor post process; a wiring board using the same; a semiconductor device; and methods for manufacturing the wiring board and the semiconductor device.SOLUTION: A metal surface coating film formation composition includes a polymer or compound including a phenolic hydroxy group and an organic solvent. The polymer or compound includes a partial structure represented by the formula (I), (where, R0 represents a hydrogen atom, a hydroxy group, a 1-10C alkyl group or the combination thereof; n represents an integer of 0-4; and*represents a binding site with the residue of the polymer or compound.).SELECTED DRAWING: Figure 3
Inventors:
KISHIOKA TAKAHIRO
Application Number:
JP2021004029A
Publication Date:
July 27, 2022
Filing Date:
January 14, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP
International Classes:
C23C26/00; H01L23/12; H05K3/28
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni
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