To form at a low cost by utilizing a regular wire bonding device.

This stopper 2 of a semiconductor acceleration sensor 1 is provided on the semiconductor acceleration sensor 1 formed by providing in rows a substrate 3a and a weight body 3c supported relatively displaceably to the substrate 3a on the chip face of a semiconductor chip 3, and prevents excessive relative displacement of the weight body 3c to the substrate 3a. The stopper 2 is equipped with a gold wire 5 disposed so that a length direction middle portion passes over the weight body 3c, for preventing relative displacement over a prescribed limit of the weight body 3c, and a support part 6 for supporting portions to be supported which are both end sides of the length direction middle portion respectively on prescribed spots on the substrate 3a. The support part 6 is equipped with a pair of support bumps formed on both sides of a gold wire center shaft at the portions to be supported, and the portions to be supported are disposed on recessed parts formed between both support bumps 10.