Title:
METALLIC COATING OF FIELD EMISSION DEVICE CONTAINING TITANIUM TUNGSTEN AND ALUMINUM
Document Type and Number:
Japanese Patent JPH08321251
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a material which is inexpensively and normally used as an electrode material of an emitter of a field emission plate display device instead of niobium and is excellent in an adhesive property to an IC and mutual connection. SOLUTION: In arrangement of a sub-layer, titanium-tungsten Ti:W and aluminum are used as the metallization material for a gate electrode 60, a bonding pad 80, lead interconnections 100 and 120 and an integrated circuit IC mounting pad 90 on an emitter plate 10 of a field emission display. In a disclosed embodiment, the metallization material is imparted by combining the sub-layer of titanium-tungusten and aluminum with niobium.
Inventors:
CHI CHIEONGU SHIEN
RESUTAA ERU HODOSON
RESUTAA ERU HODOSON
Application Number:
JP9877896A
Publication Date:
December 03, 1996
Filing Date:
April 19, 1996
Export Citation:
Assignee:
TEXAS INSTRUMENTS INC
International Classes:
H01J1/30; H01J1/304; H01J29/92; (IPC1-7): H01J1/30
Attorney, Agent or Firm:
Akira Asamura (3 outside)