Title:
METALLIC FOIL WITH ADHESION ADJUVANT, PRINTED-WIRING BOARD USING THE SAME, AND MANUFACTURING METHOD FOR PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JP2007001291
Kind Code:
A
Abstract:
To provide a wiring board which has the advantage of the formation of microwiring, electric characteristics and a manufacturing cost, and which has high reliability and proper high-frequency characteristics.
In this metallic foil with an adhesion adjuvant, an adhesion adjuvant layer with a thickness of 0.1-10 μm is provided on the metallic foil whose surface has a ten points mean roughness of Rz=2.0 μm or less. The adhesion adjuvant layer is composed of an epoxy resin composition which contains an aralkyl-type epoxy resin (A), and an aralkyl-type resin (B) with a phenolic hydroxyl group, serving as an epoxy-resin hardener.
Inventors:
OGAWA NOBUYUKI
ONOZEKI HITOSHI
TANABE TAKAHIRO
TAKAI KENJI
MORIIKE MICHIO
ONOZEKI HITOSHI
TANABE TAKAHIRO
TAKAI KENJI
MORIIKE MICHIO
Application Number:
JP2006032627A
Publication Date:
January 11, 2007
Filing Date:
February 09, 2006
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B15/092; C09J109/02; C09J121/00; C09J129/14; C09J151/04; C09J161/06; C09J163/00; H05K1/03; H05K1/09
Domestic Patent References:
| JP2004025835A | 2004-01-29 | |||
| JP2003034830A | 2003-02-07 | |||
| JP2004250470A | 2004-09-09 | |||
| JP2004075748A | 2004-03-11 | |||
| JP2002359444A | 2002-12-13 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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