METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING THE SAME

Japanese Patent JP2015045043

A

PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low whisker resistance, low adhesion abrasion characteristics, and high durability; and a connector terminal, a connector, and an electronic component using the same.SOLUTION: A metallic material for an electronic component includes: a base material 11; a lower layer 12 constituted by one, two, or more types selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co, and Cu; a middle layer 13 constituted by one, two, or more types selected from the constituent element group A and one or two types selected from a constituent element group B; an upper layer 14 constituted by an alloy including one or two types selected from the constituent element group B consisting of Sn and In, and one, two, or more types selected from a constituent element group C consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a surface processing layer including a metal constituted by one, two, or more types selected from the metal element groups constituting the lower layer, the middle layer, and the upper layer, and one or more types selected from the group consisting of O, C, S, P, and N.

FURUSAWA HIDEKI
SHIBUYA YOSHITAKA

JP2013176106A

March 12, 2015

August 27, 2013

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JX NIPPON MINING & METALS CORP

C23C28/00; C22C5/02; C22C5/04; C22C5/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C13/00; C22C19/00; C22C22/00; C22C27/06; C22C28/00; C22C38/00; C25D5/10; C25D5/12; C25D5/48; C25D5/50; C25D7/00; H01R13/03

Axis international patent business corporation

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