Title:
メタマテリアル及びその作製方法
Document Type and Number:
Japanese Patent JP6961079
Kind Code:
B2
Abstract:
The present disclosure provides a metamaterial manufacturing method. The manufacturing method includes the following steps: (a) separately adding insulating substrate powder and at least one of wave-absorbing agent powder and metal electrode powder to thermoplastic resin, and mixing them evenly to obtain a raw material; (b) applying a coextrusion process to the raw material according to a metamaterial microstructure design, to form a microstructure unit rodlike material; and (c) configuring the microstructure unit rodlike material in a cyclic microstructure configuration manner, placing the material in an extruder, and obtaining a cyclically configured metamaterial microstructure through coextrusion by using the extruder. The present disclosure further provides a metamaterial manufactured by using the foregoing method. The present disclosure provides a method for manufacturing a ceramic-substrate metamaterial that features high efficiency, low iteration costs, and a relatively high yield rate. A thinner and more efficient wave-absorbing metamaterial is obtained.
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Inventors:
Riu, Luopen
Jiao, Jia
Jou Hoi
Tan, Shin
Jiao, Jia
Jou Hoi
Tan, Shin
Application Number:
JP2020520697A
Publication Date:
November 05, 2021
Filing Date:
March 21, 2018
Export Citation:
Assignee:
KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY
International Classes:
H01Q15/14; H01P11/00
Domestic Patent References:
| JP2011014723A | ||||
| JP2001077583A | ||||
| JP2008532086A | ||||
| JP2007036154A | ||||
| JP2016519846A |
Foreign References:
| US20070222658 | ||||
| CN106032329A | ||||
| CN106207480A | ||||
| WO2017059866A2 |
Other References:
Yangbo Xie, et al.,Microwave metamaterials made by fused deposition 3D printing of a highly conductive copper-based filament,Appl. Phys. Lett. 110, 181903 (2017),2017年05月01日
Attorney, Agent or Firm:
Tsutsui International Patent Office
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