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Title:
METHOD OF ACTIVATING SUBSTRATE FOR ELECTROPLATING SYNTHETIC SUBSTANCE
Document Type and Number:
Japanese Patent JP2004197221
Kind Code:
A
Abstract:

To subject the surface of a synthetic substance to etching, activation, cleaning treatment with a promotor optionally, and metal plating by chemical reduction and/or, in succession, by electrolysis.

The etching and activation of a synthetic substance substrate are performed by a common operation stage in a first solution comprising at least one inorganic acid-containing etching reagent and an ionogen activator. The etching and activation of the synthetic substance substrate are simultaneously performed in a solution comprising one or more etching reagents, an etching activation wetting agent, and a hydrochloric acid, and noble metal ion-containing activator.


Inventors:
KOENIGSHOFEN ANDREAS
Application Number:
JP2003400018A
Publication Date:
July 15, 2004
Filing Date:
November 28, 2003
Export Citation:
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Assignee:
ENTHONE
International Classes:
C08F8/42; C23C18/16; C23C18/20; C23C18/24; C23C18/28; C25D5/56; (IPC1-7): C25D5/56
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda