Title:
METHOD OF ADHERING THIN CONDUCTIVE METAL ON INSULATED BOARD
Document Type and Number:
Japanese Patent JPS53121168
Kind Code:
A
Abstract:
Process for depositing a thin conducting metal layer on an insulating support comprising the steps of applying on said support a layer of nonconducting ink loaded with a powder of metal, alloy or metallic derivative, heating said support and said layer to harden said ink layer, treating the surface of said layer so as to lay the particles forming said powder bare and immersing said thus coated support into a bath containing, in the form of particles, the conducting metal to be deposited, under conditions which are known per se and such that said conducting metal particles are deposited on the powder particles laid bare, wherein is used as insulating support a support made of an inorganic material provided with an enamel coating and the ink used being a compound formed of an enamel and a carrier, the melting point of said enamel being substantially equal to, and preferably slightly lower than, the softening point of the outer layer of said coating.
Inventors:
IBU EMIRU PURIBA
Application Number:
JP1863278A
Publication Date:
October 23, 1978
Filing Date:
February 22, 1978
Export Citation:
Assignee:
PANODUZ ANSTALT
International Classes:
C04B41/90; C23C18/16; C23C18/18; C23C18/31; C23C18/34; C23C18/40; C23C18/44; C23D5/06; H05K1/05; H05K3/18; H05K3/24; H05K1/09; (IPC1-7): C04B41/14; C23C3/00; H05K3/18